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American Society of Mechanical Engineers. Electrical and Electronic Packaging Division

Packaging of Electronic & Photonic Devices: Presented at the 2000 Asme International Mechanical Engineering Congress and Exposition, November 5-10, 2000, Orlando, Florida (Eep (Series), Vol. 28.)
Packaging of Electronic & Photonic Devices: Presented at the 2000 Asme International Mechanical Engineering Congress and Exposition, November 5-10, 2000, Orlando, Florida (Eep (Series), Vol. 28.)
2000
 Applications of Experimental Mechanics of Electronic Packaging: Presented at the 1997 Asme International Mechanical Engineering Congress and ... 1997, Dallas, Texas (Eep (Series), Vol. 22.)
Applications of Experimental Mechanics of Electronic Packaging: Presented at the 1997 Asme International Mechanical Engineering Congress and ... 1997, Dallas, Texas (Eep (Series), Vol. 22.)
1997