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Applications of Experimental Mechanics of Electronic Packaging: Presented at the 1997 Asme International Mechanical Engineering Congress and ... 1997, Dallas, Texas (Eep (Series), Vol. 22.)

Name: Applications of Experimental Mechanics of Electronic Packaging: Presented at the 1997 Asme International Mechanical Engineering Congress and ... 1997, Dallas, Texas (Eep (Series), Vol. 22.)
Author: American Society of Mechanical Engineers. Electrical and Electronic Packaging Division
ISBN: 9780791818503

American Society of Mechanical Engineers. Electrical and Electronic Packaging Division

136 pages

Amer Society of Mechanical

Jan 1997

Hardcover

Outdoors & Nature WSBN

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Proceedings of the November 1997 symposium, a forum for presentation of research in all aspects of experimental mechanics as applied to electronic packaging. Session topics included test chips, sensors, optical methods, micromechanical testing, and mechanics of thin film debonding.

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