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Packaging of Electronic & Photonic Devices: Presented at the 2000 Asme International Mechanical Engineering Congress and Exposition, November 5-10, 2000, Orlando, Florida (Eep (Series), Vol. 28.) by American Society of Mechanical Engineers. Electrical and Electronic Packaging Division

Packaging of Electronic & Photonic Devices: Presented at the 2000 Asme International Mechanical Engineering Congress and Exposition, November 5-10, 2000, Orlando, Florida (Eep (Series), Vol. 28.)

American Society of Mechanical Engineers. Electrical and Electronic Packaging Division
299 pages
Amer Society of Mechanical
Jan 2000
Paperback
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About this book
Pages 299
Publisher Amer Society of Mech...
Published 2000
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