Packaging of Electronic Systems: A Mechanical Engineering Approach (MCGRAW HILL SERIES IN MECHANICAL ENGINEERING) by James W. Dally

Packaging of Electronic Systems: A Mechanical Engineering Approach (MCGRAW HILL SERIES IN MECHANICAL ENGINEERING)

James W. Dally
464 pages
McGraw-Hill College
Jan 1991
Hardcover
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This book is written for engineers to serve as a first text on the rapidly emerging technology of electronic packaging. Suitable for advanced undergraduate or graduate students in mechanical or electrical engineering, it covers a broad range of topics from the physics of semiconductors to the design of advanced high performance heat exchangers.
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About this book
Pages 464
Publisher McGraw-Hill College
Published 1991
Readers 0